Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024


Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng

简体网页||繁体网页
Stephen A. Campbell 作者
Oxford University Press, USA
译者
2007-09-17 出版日期
672 页数
USD 89.95 价格
Paperback
丛书系列
9780195320176 图书编码

Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 图书标签: TextBook  IC  EECS   


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Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 epub 下载 mobi 下载 pdf 下载 txt 下载 2024

Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 epub 下载 mobi 下载 pdf 下载 txt 下载 2024

Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024



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Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 图书描述

Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes. The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite-the Silvaco Athena(R) set of codes-to provide meaningful examples of many of the basic processes including diffusion, oxidation, lithography, and deposition. The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for improved performance.

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