Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024


Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng

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Stephen A. Campbell 作者
Oxford University Press, USA
译者
2007-09-17 出版日期
672 页数
USD 89.95 价格
Paperback
丛书系列
9780195320176 图书编码

Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 图书标签: TextBook  IC  EECS   


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Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 epub 下载 mobi 下载 pdf 下载 txt 下载 2024

Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 epub 下载 mobi 下载 pdf 下载 txt 下载 2024

Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024



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教材之一。同时在类似课的系主任面前pre前选取了段落完成PECVD的细节补充,概念原理就不用说了,感觉就连实验细节都快背下来了…

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面试撕逼必备

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最近比较积极的在看的书卧槽我怎么会对半导体产业感兴趣的俺真是个水性杨花的女子……【揍 -----拿了A

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Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 图书目录


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Fabrication Engineering at the Micro and Nanoscale (The Oxford Series in Electrical and Computer Eng 在线电子书 图书描述

Designed for advanced undergraduate or first-year graduate courses in semiconductor or microelectronic fabrication, the third edition of Fabrication Engineering at the Micro and Nanoscale provides a thorough and accessible introduction to all fields of micro and nano fabrication. Completely revised and updated, the text covers the entire basic unit processes used to fabricate integrated circuits and other devices. It includes more worked examples, illustrations, and expands coverage of the frontiers of fabrication processes. The physics and chemistry of each process are introduced along with descriptions of the equipment used to carry out the processes. The text uses a popular commercial process simulation suite-the Silvaco Athena(R) set of codes-to provide meaningful examples of many of the basic processes including diffusion, oxidation, lithography, and deposition. The book goes on to discuss the integration of these basic unit processes into various technologies, concentrating on CMOS transistors. The text breaks down the material into treatments on the concepts of process modules, thermal budget, advanced architectures, and the use of channel strain for improved performance.

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