Area Array Packaging Handbook: Manufacturing and Assembly 在线电子书 图书标签:
发表于2024-11-25
Area Array Packaging Handbook: Manufacturing and Assembly 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC)~*Details the pro
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Area Array Packaging Handbook: Manufacturing and Assembly 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024