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Foldable Flex and Thinned Silicon Multichip Packaging Technology 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024

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Balde, John W. 编作者

Kluwer Academic Pub

译者

2003-1 出版日期

368 页数

$ 303.97 价格

HRD

丛书系列

9780792376767 图书编码

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Foldable Flex and Thinned Silicon Multichip Packaging Technology 在线电子书 epub 下载 mobi 下载 pdf 下载 txt 下载 2024

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Foldable Flex and Thinned Silicon Multichip Packaging Technology 在线电子书 pdf 下载 txt下载 epub 下载 mobi 在线电子书下载

Foldable Flex and Thinned Silicon Multichip Packaging Technology 在线电子书图书描述

Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.

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