Foldable Flex and Thinned Silicon Multichip Packaging Technology 在線電子書 圖書標籤:
發表於2024-11-28
Foldable Flex and Thinned Silicon Multichip Packaging Technology 在線電子書 pdf 下載 txt下載 epub 下載 mobi 下載 2024
Foldable Flex and Thinned Silicon Multichip Packaging Technology presents newly emerging methods used to make stacked chip packages in the so-called 2-1/2 D technology (3-D in physical format, but interconnected only through the circuits on folded flex). It is also being used in single chip packages where the thinness of the chips and the flex substrate made packages significantly thinner than through any other means.
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Foldable Flex and Thinned Silicon Multichip Packaging Technology 在線電子書 pdf 下載 txt下載 epub 下載 mobi 下載 2024