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Handbook of 3D Integration 在線電子書 pdf 下載 txt下載 epub 下載 mobi 下載 2024

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Philip Garrou 作者

譯者

2008-10 出版日期

798 頁數

$ 285.00 價格

叢書系列

9783527320349 圖書編碼

Handbook of 3D Integration 在線電子書圖書標籤: 集成電路三維封裝

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發表於2024-08-21

Handbook of 3D Integration 在線電子書 epub 下載 mobi 下載 pdf 下載 txt 下載 2024

Handbook of 3D Integration 在線電子書 epub 下載 pdf 下載 mobi 下載 txt 下載 2024

Handbook of 3D Integration 在線電子書 pdf 下載 txt下載 epub 下載 mobi 下載 2024

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Handbook of 3D Integration 在線電子書 pdf 下載 txt下載 epub 下載 mobi 在線電子書下載

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The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two–volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry, before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA–LETI, IBM, and Renesas.

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