Advances In Multiphysics Simulation And Experimental Testing Of MEMS (Computational Adn Experimental

Advances In Multiphysics Simulation And Experimental Testing Of MEMS (Computational Adn Experimental pdf epub mobi txt 電子書 下載2025

出版者:Imperial College Press
作者:Attilio Frangi
出品人:
頁數:504
译者:
出版時間:2008-07-29
價格:USD 151.00
裝幀:Hardcover
isbn號碼:9781860948626
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This volume takes a much needed multiphysical approach to the numerical and experimental evaluation of the mechanical properties of MEMS and NEMS. The contributed chapters present many of the most recent developments in fields ranging from microfluids and damping to structural analysis, topology optimization and nanoscale simulations. The book responds to a growing need emerging in academia and industry to merge different areas of expertise towards a unified design and analysis of MEMS and NEMS.

Contents:Challenges in Modeling Liquid and Gas Flows in Micro/Nano Devices (M Gad-el-Hak); Using the Kinetic Equations for MEMS and NEMS (C Cercignani et al.); Applying the Direct Simulation Monte Carlo (DSMC) Method to Gas-Filled MEMS Devices (M A Gallis); New Approaches for the Simulation of Microfluidics in MEMS (T Y Ng et al.); Evaluating Gas Damping in MEMS Using Fast Integral Equation Solvers (A Frangi et al.); Experimental Techniques for Damping Characterization of Micro and Nanostructures (A Bosseboeuf & H Mathias); Nonlinear Dynamics of Electrostatically Actuated MEMS (S K De & N Aluru); Coupled Deformation Analysis of Thin MEMS Plates (S Mukherjee & S Telukunta); Pull-In Instability in Electrostatically Actuated MEMS Due to Coulomb and Casimir Forces (R C Batra et al.); Numerical Simulation of BioMEMS with Dielectrophoresis (G R Liu & C X Song); Continuous Modeling of Multi-Physics Problems of Microsystems for Topology Optimization (G K Ananthasuresh); Mechanical Characterization of Polysilicon at the Micro-Scale Through On-Chip Tests (A Corigliano et al.); Nano-Scale Testing of Nanowires and Carbon Nanotubes Using a Micro-Electro-Mechanical System (H D Espinosa et al.).

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