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Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) 在線電子書 pdf 下載 txt下載 epub 下載 mobi 下載 2024

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems)
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Bakir (EDT)/ Meindl (EDT)/ Sridar (EDT)/ Moukasian (EDT) 作者
Artech House Publishers
譯者
2008-11-30 出版日期
430 頁數
USD 159.00 價格
Hardcover
叢書系列
9781596932463 圖書編碼

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發表於2024-11-26

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) 在線電子書 epub 下載 mobi 下載 pdf 下載 txt 下載 2024

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) 在線電子書 epub 下載 pdf 下載 mobi 下載 txt 下載 2024

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) 在線電子書 pdf 下載 txt下載 epub 下載 mobi 下載 2024


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Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) 在線電子書 著者簡介

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) 在線電子書 著者簡介

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) 在線電子書 pdf 下載 txt下載 epub 下載 mobi 在線電子書下載

Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Integrated Microsystems) 在線電子書 圖書描述

Today's microchips have nearly reached their performance limits. Various heat removal, power delivery, chip reliability, and input/output (I/O) signaling problems stand in the way of next-generation 3D gigascale, system-on-a-chip technology, and this cutting-edge guide describes the latest breakthroughs in microfluidics, high-density compliant electrical interconnects, and nanophotonics that are converging to solve them. Engineers get full details on state-of-the-art I/O interconnects and packaging, along with the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication. It brings readers up to speed with the latest heat removal technologies including chip-scale microchannel cooling, integrated micropumps and fluidic channels, and carbon nanotube interconnects.

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