Electronic Packaging Materials and Their Properties 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024

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Michael Pecht 作者

CRC Press

译者

1998-12-18 出版日期

128 页数

USD 133.95 价格

Hardcover

丛书系列

9780849396250 图书编码

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发表于2024-11-26

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Electronic Packaging Materials and Their Properties 在线电子书 epub 下载 mobi 下载 pdf 下载 txt 下载 2024

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Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. "Electronic Packaging Materials and Their Properties" examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections; printed circuit boards; substrates; encapsulants; dielectrics; die attach materials; electrical contacts; thermal materials; and, solders."Electronic Packaging Materials and Their Properties" also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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