Electronic Packaging Materials and Their Properties 在線電子書 pdf 下載 txt下載 epub 下載 mobi 下載 2024

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Michael Pecht 作者

CRC Press

譯者

1998-12-18 出版日期

128 頁數

USD 133.95 價格

Hardcover

叢書系列

9780849396250 圖書編碼

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Electronic Packaging Materials and Their Properties 在線電子書 epub 下載 mobi 下載 pdf 下載 txt 下載 2024

Electronic Packaging Materials and Their Properties 在線電子書 epub 下載 pdf 下載 mobi 下載 txt 下載 2024

Electronic Packaging Materials and Their Properties 在線電子書 pdf 下載 txt下載 epub 下載 mobi 下載 2024

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Electronic Packaging Materials and Their Properties 在線電子書 pdf 下載 txt下載 epub 下載 mobi 在線電子書下載

Electronic Packaging Materials and Their Properties 在線電子書圖書描述

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. "Electronic Packaging Materials and Their Properties" examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections; printed circuit boards; substrates; encapsulants; dielectrics; die attach materials; electrical contacts; thermal materials; and, solders."Electronic Packaging Materials and Their Properties" also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

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