Reliability and Failure of Electronic Materials and Devices 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024


Reliability and Failure of Electronic Materials and Devices

简体网页||繁体网页
Milton Ohring 作者
Academic Press
译者
1998-6-12 出版日期
692 页数
148 价格
Hardcover
丛书系列
9780125249850 图书编码

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Reliability and Failure of Electronic Materials and Devices 在线电子书 epub 下载 mobi 下载 pdf 下载 txt 下载 2024

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Reliability and Failure of Electronic Materials and Devices 在线电子书 pdf 下载 txt下载 epub 下载 mobi 下载 2024



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Reliability and Failure of Electronic Materials and Devices 在线电子书 图书描述

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. Reliability and Failure of Electronic Materials and Devices integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects--their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed.

The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.

Key Features

* Discusses reliability and failure on both the chip and packaging levels

* Handles the role of defects in yield and reliability

* Includes a tutorial chapter on the mathematics of reliability

* Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints

* Considers defect detection methods and failure analysis techniques

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