Modern Semiconductor Devices for Integrated Circuits

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Chenming Calvin Hu holds the TSMC Distinguished Professor Chair of Microelectronics at University of California, Berkeley. He is a member of the US Academy of Engineering and a foreign member of the Chinese Academy of Sciences. From 2001 to 2004, he was the Chief Technology Officer of TSMC. A Fellow of the Institute of Electrical and Electronic Engineers (IEEE), he has been honored with the Jack Morton Award in1997 for his research on transistor reliability, the Solid State Circuits Award in 2002 for co-developing the first international standard transistor model for circuit simulation, and the Jun-ichi Nishizawa Medal in 2009 for exceptional contributions to device physics and scaling. He has supervised over 60 Ph.D. student theses, published 800 technical articles, and received more than 100 US patents. His other honors include Sigma Xi Moni Ferst Award, R&D 100 Award, and UC Berkeley’s highest award for teaching — the Berkeley Distinguished Teaching Award.

For additional information, visit the author's Web site.

出版者:Prentice Hall
作者:Chenming C. Hu
出品人:
页数:384 pages
译者:
出版时间:April 1, 2009
价格:$118.00
装帧:Hardcover
isbn号码:9780136085256
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  • 英文原版 
  • 学术 
  • 那是我的梦想 
  • 胡正明 
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Modern Semiconductor Devices for Integrated Circuits, First Edition introduces readers to the world of modern semiconductor devices with an emphasis on integrated circuit applications. KEY TOPICS: Electrons and Holes in Semiconductors; Motion and Recombination of Electrons and Holes; Device Fabrication Technology; PN and Metal–Semiconductor Junctions; MOS Capacitor; MOS Transistor; MOSFETs in ICs—Scaling, Leakage, and Other Topics; Bipolar Transistor. MARKET: Written by an experienced teacher, researcher, and expert in industry practices, this succinct and forward-looking text is appropriate for anyone interested in semiconductor devices for integrated curcuits, and serves as a suitable reference text for practicing engineers.

具体描述

读后感

评分

本书中的内容除了里面的基本物理知识,里面的很多内容都是涉及到很前沿的技术内容,就像关于近几年的技术综述似的,非常不错!里面的很多章节跟应用联系紧密,如Imager 和memory 都介绍的很好,还有建模的知识,对我来说是新的东西。

评分

本书中的内容除了里面的基本物理知识,里面的很多内容都是涉及到很前沿的技术内容,就像关于近几年的技术综述似的,非常不错!里面的很多章节跟应用联系紧密,如Imager 和memory 都介绍的很好,还有建模的知识,对我来说是新的东西。

评分

本书中的内容除了里面的基本物理知识,里面的很多内容都是涉及到很前沿的技术内容,就像关于近几年的技术综述似的,非常不错!里面的很多章节跟应用联系紧密,如Imager 和memory 都介绍的很好,还有建模的知识,对我来说是新的东西。

评分

本书中的内容除了里面的基本物理知识,里面的很多内容都是涉及到很前沿的技术内容,就像关于近几年的技术综述似的,非常不错!里面的很多章节跟应用联系紧密,如Imager 和memory 都介绍的很好,还有建模的知识,对我来说是新的东西。

评分

本书中的内容除了里面的基本物理知识,里面的很多内容都是涉及到很前沿的技术内容,就像关于近几年的技术综述似的,非常不错!里面的很多章节跟应用联系紧密,如Imager 和memory 都介绍的很好,还有建模的知识,对我来说是新的东西。

用户评价

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Undergraduate level 的器件教材中很现代的一本,作者无敌牛逼...

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最后写道 If the complete Ids equation of BSIM model is printed out on a paper, it will fill several pages. 呵呵那哥看了好多天都看了些啥啊...

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最后写道 If the complete Ids equation of BSIM model is printed out on a paper, it will fill several pages. 呵呵那哥看了好多天都看了些啥啊...

评分

最后写道 If the complete Ids equation of BSIM model is printed out on a paper, it will fill several pages. 呵呵那哥看了好多天都看了些啥啊...

评分

最后写道 If the complete Ids equation of BSIM model is printed out on a paper, it will fill several pages. 呵呵那哥看了好多天都看了些啥啊...

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